Semiconductors
07-15[silicon]Arrays, Timing, and Structured Compute: Industry Circuits in 202618m06-27[silicon]AmpereOne Hides Memory Tags in the Bits a Server Already Pays For19m06-27[silicon]Li Auto Lets the Compiler Drive Data Instead of Rebuilding a GPU Cache20m06-27[silicon]The PCIe Tax on CXL, and the 4 nm Silicon Built to Repeal It22m06-27[silicon]Dropping the PHY: d-Matrix Bonds Compute Directly onto DRAM19m06-27[silicon]Microsoft's Rowhammer Defense Sleeps Until One Sub-Bank Looks Dangerous20m06-16[silicon]Three Nanosheets over Three: Samsung Builds Logic Upward at 42 nm14m02-17[silicon]What Commercial AI EDA Has Actually Put Through Tapeout21m02-10[silicon]The Next EDA Advantage Is a Recipe That Transfers15m01-21[silicon]Place and Route Is Becoming an Objective Negotiation14m
# 2025
12-08[silicon]CFET Leaves the Device Lab: TSMC Runs an Oscillator and SRAM below 48 nm14m11-19[silicon]Evatec Uses Film Stress to Flatten the Packaging Wafer16m09-10[silicon]At 100 GHz, the Laser Package Becomes Part of the Circuit14m09-08[silicon]Precision Moves Into the Architecture: Industry Circuits in 202519m08-27[silicon]The Soft Materials Set the Shape of the Advanced Package16m06-22[silicon]Why AI Reached Industrial Physical Design Before Architecture15m06-21[silicon]No HBM, No Apologies: MTIA 2i and Meta's Productionization Ledger19m05-27[silicon]IBM Moves the Heat Spreader into the Organic Substrate16m02-17[silicon]A 600 mm² Mainframe Die Becomes a System: Inside IBM Telum II16m# 2024
12-11[silicon]When AI Placement Becomes Production Silicon21m09-09[silicon]What Industry Put on Silicon in 202418m06-29[silicon]MI300A Turns the Accelerator Package into the Compute Node19m06-29[silicon]FuriosaAI Replaces the Fixed Matrix with a Shape-Shifting Tensor Engine20m